Deep reactive-ion etching - Wikipedia
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excav… See more
Cryogenic processIn cryogenic-DRIE, the wafer is chilled to −110 °C (163 K). The low temperature slows down the chemical reaction that … See more
Deep Reactive Ion Etching - an overview | ScienceDirect Topics
29 rows · Deep reactive ion etching is a highly anisotropic etch process used to create high-aspect-ratio silicon structures and intricate morphologies, both with tight tolerances in a …
Deep reactive ion etching - ScienceDirect
Jan 1, 2020 · Reactive ion etching (RIE), also known as plasma etching or dry etching, and its extension deep RIE (DRIE) are processes that combine physical and chemicals effects to …
Deep RIE: What is Deep Reactive Ion Etching (DRIE)? - Atomica
Deep reactive ion etching (DRIE, or Deep RIE) is a plasma-based etching process that yields deep holes and trenches with steep sides. With DRIE, a silicon wafer can be etched …
Recent Advances in Reactive Ion Etching and …
Aug 20, 2021 · The most widely known of these technologies is called the inductively-coupled plasma (ICP) deep reactive ion etching (DRIE) and this has become a mainstay for development and production of silicon-based micro- …
Reactive Ion Etching (RIE) - SpringerLink
Reactive ion etching (RIE) is a plasma process where radiofrequency (RF) discharge-excited species (radicals, ions) etch substrate or thin films in a low-pressure chamber. RIE is a synergistic process between chemically active …
To Bosch or Not to Bosch: Deep Reactive Ion Etching …
Apr 8, 2021 · Discussing the two common etching methods for deep reactive ion etching of silicon (DRIE), which are the Bosch and non-Bosch (single-step DRIE) processes.
Silicon Deep Reactive Ion Etching (Si-DRIE): Cutting …
Apr 2, 2024 · Silicon Deep Reactive Ion Etching (Si-DRIE) is a cornerstone technology in semiconductor and Micro-Electro-Mechanical Systems (MEMS) fabrication. This field has a pivotal role in the advancement of high …
Con: Limited aspect ration (~10:1) Hard to etch deep (selectivity issues) KOH with {110} wafers. Pro: High aspect ratio > 600:1.
Deep Reactive Ion Etching (DRIE) - Oxford Instruments
Learn about the Bosch and Cryogenic processes for deep, anisotropic etching of silicon for MEMS, microfluidics and nanotechnology applications. Explore the features and benefits of the Estrelas DSiE system and request a quote.
