TrendForce reported that the global revenue for the DRAM module market reached US$12.5 billion in 2023—a YoY decline of 28%. This drop was primarily attributed to the inventory correction period for ...

"The rise of generative AI applications is fundamentally reshaping the demand for back-end Ethernet server connectivity, particularly for training large language models and AI server clusters," said ...

Imagination Technologies unveiled Imagination DXS GPU, its latest automotive GPU IP for in-vehicle intelligence and interaction. DXS is a scalable and flexible GPU IP designed to process graphics and ...

Yole said back-end semiconductor equipment market faces short-term decline but anticipates recovery with adoption of advanced packaging techniques, where it outlines below points: The back-end ...

Navitas Semiconductor has announced GaNSlim, a new generation of highly-integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density ...

Tachyum said it has successfully achieved the desired performance and stability of the Linux operating system and applications running as part of QEMU emulations and will expand all testing and ...

Texas Instruments launched a new programmable logic portfolio to help engineers go from concept to prototype in minutes. New programmable logic devices and no-code design tool reduce engineering ...

Intel and AMD created x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture. x86 is uniquely positioned to meet ...

IDC reported that the global smartphone shipments increased 4.0% year over year to 316.1 million units in the third quarter of 2024 (3Q24). This marks the fifth consecutive quarter of shipment growth ...

At the recently held OCP Global Summit, MediaTek, an industry leader in ASIC with more than 1 billion units shipped and over 70 product tape-outs demonstrated its silicon proven long reach 224G SerDes ...

Industry body SEMI estimates the global semiconductor packaging materials market powered by strong semiconductor demand across diverse end applications to start a growth cycle with a 5.6% compound ...