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Intel's EMIB packaging tech is now supported by industry-standard design and test tools
Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology is already used for multiple products designed by the company itself, but its widespread adoption by Intel ...
tom's Hardware on MSN4d
Intel doesn't plan to bring 3D V-Cache-like tech to consumer CPUs for now — next-gen Clearwater Forest Xeon CPUs will feature "Local Cache" in the base tile akin to A…
Intel confirms that its Clearwater Forest CPUs will separate the CPU cores and cache into separate tiles, mirroring AMD's X3D ...
Ummid7h
Meet Gang Duan: Intel’s Inventor of Year 2024
Gang Duan, who works in Chandler, Arizona, as Principal Engineer and Backend Area Manager in Intel’s Substrate Packaging ...
Neowin3y
Here is Intel's architecture roadmap for 2025 and beyond0 0
Intel 7 - previously known as Enhanced SuperFin ... Embedded multi-die interconnect bridge (EMIB) has been used in products since 2017 and will continue to be used in Sapphire Rapids next ...
ZDNet3y
Moore's Law Under the Microscope: Intel Advances Process & Packaging
EMIB allows Intel to build out chips with an ever-increasing number of chiplets. The key is to build high-performance interconnects (think of these as circuit board traces, but running inside ...
CRN3y
Intel’s $3.5B New Mexico Campus Upgrade To Boost Next-Gen Chips
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...