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Intel's EMIB packaging tech is now supported by industry-standard design and test tools
Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology is already used for multiple products designed by the company itself, but its widespread adoption by Intel ...
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Meet Gang Duan: Intel’s Inventor of Year 2024
Gang Duan, who works in Chandler, Arizona, as Principal Engineer and Backend Area Manager in Intel’s Substrate Packaging ...
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Intel doesn't plan to bring 3D V-Cache-like tech to consumer CPUs for now — next-gen Clearwater Forest Xeon CPUs will feature "Local Cache" in the base tile akin to A…
Intel confirms that its Clearwater Forest CPUs will separate the CPU cores and cache into separate tiles, mirroring AMD's X3D ...