And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

The temperature is controlled via USB by a computer, allowing [Edmar] to set a temperature profile as recommended by the BGA chip’s data sheet. Right now, removing a BGA chip works great ...

BGA Ball-grid array (BGA ... CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs ...

IC Probing / Analysis Adapters Sockets or adapters used for measuring and testing circuit boards. BGA Ball-grid array (BGA ... response to the need for high power and high speed ICs. CSP Chip scale ...

Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 ...